improved contact design (pre bend) 0,635 0,025 0 to +70c inau kontaktoberfl?che cat 5 part no. bertragungsanforderung 133183 note 1: rohs compliant cat 5 cat 3/4 133184 [in] -40 to +85c cat 5 203512 0 to +70c ident. nr. transmission requirement 0 to +70c x.xx = 0,25 mm 30 inau 30 inau 50 inau contact finish 30 133934 prior notice. contact one of the erni companies date 20.05.2010 i index mj 8p8c, 1x1, vertical mod jack - mjhv 133819 2:1 information: tolerances scale all dimensions in mm class i subject to modification without a3 designation www.erni.com before using. drawing will not be updated. all rights reserved. only for information. to ensure that this is the latest version of this drawing, please copyright by erni gmbh proprietary notice pursuant to iso 16016 to be observed. 1:1 operation temperature betriebstemperatur 16,59 0,653 1 8 15,86 0,624 1 3 5 7 recommended pcb layout (component side view) empfohlenes leiterplatten-layout (bestueckungsseite) 2 4 6 8 tol 0,05 mm unless noted 1,60 x2 0,063 0,035 x8 0,89 3,25 x2 0,128 1,27 0,050 0,450 11,43 0,617 15,66 0,150 3,81 0,350 8,89 0,100 2,54 2,54 0,100 2,54 0,100 3,81 0,150 8,89 0,350 16,38 0,645 1,70 0,067 2,85 0,112 4,05 0,159 3,20 0,126 6,65 0,262 17,16 0,676 recommended panel cutout empfohlener frontplatten-ausschnitt 16,43 0,647 0,010 0,25 r 17,08 0,672 technical specifications materials & finish standard applic. value test data standard applic. value insulation body standard description pbt 30% mechanical properties contact material standard description c5210 (acc. jis) insertion/withdrawal force iec 603-7 max. 20 n contact finish, mating zone thickness of plating see chart mechanical operations iec 512-5, 9a min. 1.000 contact finish termination zone thickness of plating 80 in matte sn over 50 in ni effectiveness of connector shell/shield material standard description c2680 (acc. jis) coupling device iec 512-8, 15f 50 n shell/shield plating thickness of plating 50 in ni electrical properties creepage / clearance distances assembly process a) contact - contact iec 807-3 0,52 mm packaging tray b) contact - shell iec 807-3 min. 1,0 mm solder temperature 235c at 3-5 s voltage proof (dielectric withstand voltage) suitable assembly process wave a) contact - contact iec 512-2, 4a min. 1.000 v ac/dc b) contact - shell/testpanel iec 512-2, 4a min. 1.500 v ac/dc approvals current carrying capacity iec 512-3, 5b 1,5 a @ 25 c ul insulation body ul 94 v0 contact resistance iec 512-2, 2a max. 30 mohm ul file no. e145613 insulation resistance iec 512-2, 3a min. 500 mohm rohs compliant yes environmental properties operation temperature see chart
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